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Pechiney Plastic Packaging parafilm tape
Parafilm Tape, supplied by Pechiney Plastic Packaging, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/parafilm+tape/parafilm+tape/pmc11508693-85-6-8
Average 90 stars, based on 1 article reviews
parafilm tape - by Bioz Stars, 2026-09
90/100 stars

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Article Title: Evidence for inbreeding depression in the food-deceptive colour-dimorphic orchid Dactylorhiza sambucina (L.) Soò.
Article Snippet: The Petri dishes were sealed with Parafilm tape (Pechiney, Menasha, Wisconsin) and kept in an unlit growth chamber at 20 8C.

Article Title: Buffer-regulated biocorrosion of pure magnesium.
Article Snippet: Magnesium (Mg) alloys are being actively investigated as potential load-bearing orthopaedic implant materials due to their biodegradability in vivo.. With Mg biomaterials at an early stage in their development, the screening of alloy compositions for their biodegradation rate, and hence biocompatibility, is reliant on cost-effective in vitro methods.. The use of a buffer to control pH during in vitro biodegradation is recognised as critically important as this seeks to mimic pH control as it occurs naturally in vivo.

Incubation:

Article Title: Host Deception: Predaceous Fungus, Esteya vermicola , Entices Pine Wood Nematode by Mimicking the Scent of Pine Tree for Nutrient
Article Snippet: .. Two ends of the tube were sealed with parafilm tape (Pechiney Plastic Packaging Company), and the tube was incubated in the dark at 26°C for 0.5 h to establish a concentration gradient of VOCs. ..

Article Title: Morpho-Molecular Identification of Fusarium equiseti and Fusarium oxysporum Associated with Symptomatic Wilting of Potato from Pakistan
Article Snippet: Four leaf pieces were placed on Petri plates containing potato dextrose agar (PDA) (Merck KGaA, Darmstadt, Germany) amended with ampicillin (20 mg/mL) and rifampicin (75 mg/mL; Thermo Fisher Scientific, Waltham, MA, USA). .. All the plates were sealed with parafilm tape (Pechiney, Paris, France), labeled with an isolate code and date of isolation, and incubated at 25 °C with 12 h of light per day for 4–7 days. ..

Concentration Assay:

Article Title: Host Deception: Predaceous Fungus, Esteya vermicola , Entices Pine Wood Nematode by Mimicking the Scent of Pine Tree for Nutrient
Article Snippet: .. Two ends of the tube were sealed with parafilm tape (Pechiney Plastic Packaging Company), and the tube was incubated in the dark at 26°C for 0.5 h to establish a concentration gradient of VOCs. ..

Labeling:

Article Title: Morpho-Molecular Identification of Fusarium equiseti and Fusarium oxysporum Associated with Symptomatic Wilting of Potato from Pakistan
Article Snippet: Four leaf pieces were placed on Petri plates containing potato dextrose agar (PDA) (Merck KGaA, Darmstadt, Germany) amended with ampicillin (20 mg/mL) and rifampicin (75 mg/mL; Thermo Fisher Scientific, Waltham, MA, USA). .. All the plates were sealed with parafilm tape (Pechiney, Paris, France), labeled with an isolate code and date of isolation, and incubated at 25 °C with 12 h of light per day for 4–7 days. ..

Isolation:

Article Title: Morpho-Molecular Identification of Fusarium equiseti and Fusarium oxysporum Associated with Symptomatic Wilting of Potato from Pakistan
Article Snippet: Four leaf pieces were placed on Petri plates containing potato dextrose agar (PDA) (Merck KGaA, Darmstadt, Germany) amended with ampicillin (20 mg/mL) and rifampicin (75 mg/mL; Thermo Fisher Scientific, Waltham, MA, USA). .. All the plates were sealed with parafilm tape (Pechiney, Paris, France), labeled with an isolate code and date of isolation, and incubated at 25 °C with 12 h of light per day for 4–7 days. ..

Stripping Membranes:

Article Title: Electrowetting of sessile drops on soft dielectric elastomer films
Article Snippet: Application of an electrical voltage to a conducting sessile droplet resting on a thin dielectric film covering a planar electrode results in enhanced wetting of the droplet.. Such electrically controlled wetting of a droplet on a dielectric film is classically referred to as ‘electrowetting-on-dielectric (EWOD)’ or ‘electrowetting’ (Berthier 2008; Mugele and Baret 2005).. The detailed understanding of, and control over, the electrowetting phenomenon developed over the years has translated into several state-of-the-art applications, such as variable focus lenses (Mugele and Baret 2005; Shamai et al. 2008), reflective displays (Mugele and Baret 2005; Shamai et al. 2008), microfluidic mixing (Mugele et al. 2006), three-dimensional digital microfluidic systems (Hong and Lee 2015), thermal management of miniaturized devices (Paik et al. 2008), and several biomedical applications (Choi et al. 2012).



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Bemis Inc parafilm ® tape
Summary and illustration of the microfabrication process. The microfabrication process for the access ports wafer is excluded due to redundancy. 1. Start with new glass wafer and <t>sputter</t> <t>chromium</t> (Cr) both sides. 2. Apply SPR 220–7 on top side, S1813 on bottom side. UV exposure to define ESI tip edge on top side. UV exposure to define alignment marks on bottom side. Develop both sides. Etch Cr both sides. 3. Apply <t>Parafilm</t> ® tape on bottom side. 4. Etch glass in HF and remove both photoresists and Parafilm ® tape. Alignment marks remain on bottom side. 5. Apply SU8 3010 on bottom side. UV exposure to define microchannels on bottom side (alignment marks not illustrated for simplification). Develop SU8 3010 on bottom side. 6. Apply SPR 220–7 on bottom side. UV exposure to define ESI tip and alignment marks (not shown) on bottom side. Develop SPR 220–7. 7. Etch Cr and etch glass in HF. Remove SPR 220–7. 8. Etch Cr and etch glass in HF with Parafilm ® applied on bottom side. 9. Remove SU8 3010 and Parafilm ® . Etch Cr both sides. 10. Surface plasma activation and thermal fusion bonding of the access ports wafer and the microchannels wafer.
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Summary and illustration of the microfabrication process. The microfabrication process for the access ports wafer is excluded due to redundancy. 1. Start with new glass wafer and sputter chromium (Cr) both sides. 2. Apply SPR 220–7 on top side, S1813 on bottom side. UV exposure to define ESI tip edge on top side. UV exposure to define alignment marks on bottom side. Develop both sides. Etch Cr both sides. 3. Apply Parafilm ® tape on bottom side. 4. Etch glass in HF and remove both photoresists and Parafilm ® tape. Alignment marks remain on bottom side. 5. Apply SU8 3010 on bottom side. UV exposure to define microchannels on bottom side (alignment marks not illustrated for simplification). Develop SU8 3010 on bottom side. 6. Apply SPR 220–7 on bottom side. UV exposure to define ESI tip and alignment marks (not shown) on bottom side. Develop SPR 220–7. 7. Etch Cr and etch glass in HF. Remove SPR 220–7. 8. Etch Cr and etch glass in HF with Parafilm ® applied on bottom side. 9. Remove SU8 3010 and Parafilm ® . Etch Cr both sides. 10. Surface plasma activation and thermal fusion bonding of the access ports wafer and the microchannels wafer.

Journal: Microelectronic engineering

Article Title: Stable electrospray signal on a microfabricated glass chip with three-dimensional open edge and tiered depth geometries

doi: 10.1016/j.mee.2023.111997

Figure Lengend Snippet: Summary and illustration of the microfabrication process. The microfabrication process for the access ports wafer is excluded due to redundancy. 1. Start with new glass wafer and sputter chromium (Cr) both sides. 2. Apply SPR 220–7 on top side, S1813 on bottom side. UV exposure to define ESI tip edge on top side. UV exposure to define alignment marks on bottom side. Develop both sides. Etch Cr both sides. 3. Apply Parafilm ® tape on bottom side. 4. Etch glass in HF and remove both photoresists and Parafilm ® tape. Alignment marks remain on bottom side. 5. Apply SU8 3010 on bottom side. UV exposure to define microchannels on bottom side (alignment marks not illustrated for simplification). Develop SU8 3010 on bottom side. 6. Apply SPR 220–7 on bottom side. UV exposure to define ESI tip and alignment marks (not shown) on bottom side. Develop SPR 220–7. 7. Etch Cr and etch glass in HF. Remove SPR 220–7. 8. Etch Cr and etch glass in HF with Parafilm ® applied on bottom side. 9. Remove SU8 3010 and Parafilm ® . Etch Cr both sides. 10. Surface plasma activation and thermal fusion bonding of the access ports wafer and the microchannels wafer.

Article Snippet: Afterwards, both wafers were placed into a chromium etch bath (Transene Chromium Etchant 1020, Danvers, MA) for 1 min. Parafilm ® tape (Bemis, Sheboygan Falls, WI) was manually applied to the access port wafer’s bottom side and the microchannel wafer’s top side.

Techniques: Clinical Proteomics, Activation Assay